获奖情况：
1. 2023 年度工信部技术发明二等奖（R4）
2. 2021 年度仪器仪表学会技术发明一等奖（R4）
发明专利：
[1] 张紫辰,张喆,张利,彭谞睿,李进 一种稳定的空间光通信光斑调节方法 CN120559884A
代表性论文：
[1] Zhang Z, Wen Z, Shi H, et al. Dual Laser Beam Asynchronous Dicing of 4H-SiC Wafer[J]. Micromachines, 2021, 12(11): 1331.
[2] 张喆, 宋琦, 张昆鹏, 薛美, 侯煜, 张紫辰. 平顶飞秒激光开槽硅晶圆工艺仿真与实验研究[J]. 中国激光, 2023, 50(20):2002202.
[3] Li Y, Zhang Z, Peng X, et al. Progress in Atomic-Scale Computational Simulations for Carbon Nanotube Materials and Devices[J]. Advanced Devices & Instrumentation, 2025, 6: 0094.
[4] Cai S, Ding Y, Ding M, et al. Damage‐Free Full‐Thickness Dicing of Ultra‐Thin GaAs Wafers Using a Femtosecond Laser with Low Residual Stress[J]. Advanced Science, 2025: e15347.
[5] Zhang S, Li Y, Cai S, et al. Optimizing Repetition Rate and Fluence for Improved Groove Depth in Femtosecond Laser Processing of Silicon[J]. Journal of Materials Research and Technology, 2025.
