博士后流动站

博士后流动站

段岑林
博士后
duancenlin@buaa.edu.cn

基本情况

教育经历:

2011-2015 电子科技大学 电子科学与技术 本科

2015-2018 西安电子科技大学 软件工程 硕士研究生

2021-2026 det365在线登录 电子信息 博士研究生

工作经历:

2018-2021 中国空间技术研究院 工程师

2026至今 det365 博士后

研究方向

存算一体架构与系统

教学科研成果

获奖情况:

1. 北京市优秀毕业生

2. 奋进奖学金

3. 全国微电子研究生学术论坛最佳论文奖

4. 第二届Synopsys ARC杯电子设计大赛一等奖

5. 第十一届中国研究生电子设计竞赛西北赛区三等奖

发明专利:

[1] 杨建磊、段岑林、赵巍胜 基于 SRAM 的双倍数据存储容量的存内计算方法和装置 CN202310980955.7

代表性论文:

[1] Cenlin Duan, Jianlei Yang, Yiou Wang, Yikun Wang, Yingjie Qi, Xiaolin He, Bonan Yan, Xueyan

Wang, Xiaotao Jia, and Weisheng Zhao. Towards Efficient SRAM-PIM Architecture Design by Exploiting Unstructured Bit-Level Sparsity. ACM/IEEE Design Automation Conference (DAC), 2024.

(CCF-A)

[2] Cenlin Duan, Jianlei Yang, Xiaolin He, Yingjie Qi, Yikun Wang, Yiou Wang, Ziyan He, Bonan Yan,Xueyan Wang, Xiaotao Jia, Weitao Pan, and Weisheng Zhao. DDC-PIM: Efficient Algorithm/Architecture Co-design for Doubling Data Capacity of SRAM-Based Processing-In-Memory. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2024. (CCF-A) (Awarded Best Paper at the 2023 National Microelectronics Graduate Academic Forum)

[3] Cenlin Duan, Jianlei Yang, Yikun Wang, Yiou Wang, Yingjie Qi, Xiaolin He, Bonan Yan, Xueyan

Wang, Xiaotao Jia, and Weisheng Zhao. Efficient SRAM-PIM Co-design by Joint Exploration of

Value-Level and Bit-Level Sparsity. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2025. (CCF-A)

[4] Cenlin Duan, Jianlei Yang, Rubing Yang, Yikun Wang, Yiou Wang, Lingkun Long, Yingjie Qi, Xiaolin He, Ao Zhou, Xueyan Wang, and Weisheng Zhao. HPIM: Heterogeneous Processing-In-Memory-based Accelerator for Large Language Models Inference. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2026. (CCF-A)

[5] Rubing Yang, Cenlin Duan, Yikun Wang, Yiou Wang, Ling Tang, Bohan Wang, and Jianlei Yang.SPIMOE: Exploiting Hybrid Sparsity for Reasoning MoE Inference on Heterogeneous PIM Architectures. IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 2026, (CCF-B), (Corresponding authors)

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